SK hynix-TetraMem collaboration featured on Tom’s Hardware
Read how Tom’s Hardware spotlights TetraMem’s joint work with SK
July 16, 2026
Read how Tom’s Hardware spotlights TetraMem’s joint work with SK
Our joint research paper with the SK Hynix, “A Memristor-based In-Memory Computing SoC with Efficient Depthwise Convolution,” has been accepted and published online in Advanced Intelligent Systems https://advanced.onlinelibrary.wiley.com/doi/10.1002/aisy.202501225
TetraMem Completes MLX200 Silicon Validation. TetraMem’s MLX200 is the first multi-level RRAM analogue in-memory computing SoC on 22nm silicon, delivering energy-efficient AI inference for edge, IoT, and wearables.
TetraMem and researchers from the University of Southern California and the University of Massachusetts Amherst demonstrated RRAM (memristor) devices capable of reliable operation at temperatures up to 700°C. Science article “High-temperature memristors enabled by interfacial engineering.” https://www.science.org/doi/10.1126/science.aeb9934