June 11, 2026

The End of Moore’s Law for SRAM

For decades, the AI and semiconductor industries have relied on the continuous shrinking of transistors to double computing power, a principle known as Moore’s Law. However, as technology nodes push below 5nm, a critical component of every AI chip is quietly hitting a physical wall: SRAM (Static Random-Access Memory).

The SRAM Dependency in AI SRAM is the lightning-fast, on-chip memory used for caches and registers inside digital processors. Because AI applications—especially massive Large Language Models (LLMs)—require vast amounts of data to be processed with minimal latency, having memory directly on the chip is crucial for performance. For example, modern AI GPUs are packed with tens of megabytes of SRAM to keep compute cores fed with data.

The “Flat Scaling” Crisis While purely digital logic components continue to benefit from shrinking down to 3nm and beyond, SRAM is a mixed-signal design that does not scale effectively with Moore’s Law. As transistor sizes decrease, SRAM cells suffer from increasing leakage currents, random dopant fluctuations, and severe read/write stability issues.

Below the 5nm threshold, the scaling benefits for SRAM face a significant flattening of density improvements. This bottleneck is so severe that major industry players are being held back; for instance, Nvidia continues to use the 4nm (N4P) process for their advanced B200 GPUs specifically due to the difficulties and diminishing returns associated with scaling SRAM.

What This Means for AI Processors Because SRAM cannot scale effectively, we are severely limited in how much memory we can physically fit onto a single AI chip. When on-chip SRAM capacity is insufficient, AI processors are forced to constantly fetch massive AI models and datasets from off-chip memory, such as DRAM or HBM.

This constant data movement triggers the infamous von Neumann bottleneck, where transferring data across a bus consumes 10 to 100 times more energy than the actual mathematical computation itself. As a result, traditional digital AI chips are hitting a hard efficiency ceiling, struggling to achieve energy efficiency beyond 10 TOPS/W (Tera Operations Per Second per Watt). We can no longer rely on cramming more SRAM onto a chip to solve the AI power crisis.

Break Through the Scaling Wall with TetraMem The end of SRAM scaling means the industry requires a fundamental computing paradigm shift toward analog in-memory computing (IMC).

TetraMem is leading this revolution by completely bypassing SRAM limitations with its breakthrough multi-level RRAM (computing memristor) analog in-memory compute solution. Unlike SRAM, which requires 6 to 8 transistors just to store a single bit, TetraMem utilizes a highly scalable One-Transistor-One-Resistor (1T1R) crossbar architecture. By computing massive matrix multiplications directly where the data is stored using the physical laws of nature, TetraMem entirely eliminates the high-energy data commute and the von Neumann bottleneck.

Don’t let the flat scaling of legacy digital memory hold back your AI infrastructure. With a proven, highly scalable technology roadmap targeting over 300 TOPS/W, TetraMem is delivering the future of AI hardware. Explore how TetraMem’s analog in-memory computing solutions can transform your AI efficiency today.

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